Specific Process Knowledge/Characterization

Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal

Overview of characteristics and where to measure it

Optical Micro- scopes

SEM (incl. EDX)

AFM

Stylus profiler

Optical profiler

Filmtek (reflec- tometer)

Ellip- someter

Thickness stylus

XPS

PL mapper

4-point probe

Probe station

XRD

Life time scanner

Drop shape analyser

Hardness tester

Particle scanner

IR-camera

III-V ECV-profiler

Microspectrophotometer (Craic 20/30 PV)

Breakdown voltage

Carrier density/doping profile

x

Charge carrier life time

x

Contact angle hydrophobic/hydrophillic

x

Crystallinity

x

Deposition uniformity

x

x

x

Dimensions(in plane)

x

x

(x)

(x)

x

x|

Dimensions(height)/Topography

(x)

(x)

x

x

x

Electrical conductivity

x

Element analysis

x

x

x 4)

x 4)

Film stress

x

x 7)

Imaging

x

x

x

x

x|

Material Hardness

x

Band gap

x

x

x

Particles

x

x

x

x

x|

Phase changes

Reflectivity

x

x

x 6)

x|

Refractive index

x

x

Resistivity

x

Step coverage

x 1)

x 1)

Surface roughness

x

x

x

x

Thermal conductivity

Thin film thickness

x 1)

x 1)

x 2)

x 2)

x

x

x

x 5)

x 3)

x

Voids in wafer bonding

x

x

x

Wafer thickness

x 1)

x 1)

x

Work function

x

1. Using the cross section method
2. Using the create step method
3. With known resistivity
4. Composition information for crystalline materials
5. Only single layer
6. Good for characterization of VCSEL structures and DBR mirrors
7. Only for crystalline films

Choose characterization topic

• Element analysis
• Measurement of film thickness and optical constants
• Photoluminescence mapping
• Sample imaging
• Sample preparation for inspection
• Stress measurement
• Hardness measurement
• Wafer thickness measurement
• Topographic measurement

• Contact angle measurement
• Four-Point Probe (Resistivity measurement)
• Carrier density (doping) profiler
• Scanning Electron Microscopy
• X-ray diffraction

Choose equipment

AFM

• AFM - Atomic Force Microscopy

Electrical measurements

• 4-Point Probe
• Probe station
• III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)

Element analysis

• SEM with EDX
• XPS tools

Optical and stylus profilers

• Optical Profiler (Sensofar)
• Dektak XTA stylus profiler
• P17 stylus profiler from KLA-Tencor
• Dektak 3ST stylus profiler
• Stylus Profiler:Dektak150

Optical microscopes

• Optical microscopes

Optical characterization

• Ellipsometer
• Filmtek 4000
• PL mapper - Photoluminescence mapper
• Lifetime scanner MDPmap

SEMs at DTU Nanolab - building 307/314

• Dual Beam FEI Helios Nanolab 600
• SEM FEI Nova 600 NanoSEM
• SEM FEI Quanta 200 ESEM FEG

SEM's in building 346

• SEM Comparison page
• SEM Supra 1
• SEM Supra 2
• SEM Supra 3
• SEM Tabletop 1

TEMs at DTU Nanolab - building 307/314

• Titan ATEM
• Titan ETEM
• Tecnai TEM

XRD

• XRD Powder, tabletop XRD for Bregg-Brentano measurements of powders
• XRD SmartLab, advanced multipurpose instrument in the cleanroom

Various

• Drop Shape Analyzer
• Thickness Measurer
• Hardness tester
• Particle Scanner Takano

Decommissioned equipment

• KLA-Tencor Surfscan 6420
• Phillips X-Ray Diffractometer that was owned by DTU Fotonik