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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/Nitride Etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,318 edits
Line 18: Line 18:
|Coil Power [W]
|Coil Power [W]
|2500
|2500
|200
|3840


|-
|-
|Platen Power [W]
|Platen Power [W]
|300
|300
|50
|300


|-
|-
Line 33: Line 33:
|H2 flow [sccm]
|H2 flow [sccm]
|25.6
|25.6
|15
|0
|-
|-
|He flow [sccm]
|He flow [sccm]
Line 47: Line 47:
|Pressure [mTorr]
|Pressure [mTorr]
|8.8
|8.8
|10
|0.9


|-
|-
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