Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions
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== Process information == | == Process information == | ||
Revision as of 08:32, 22 August 2023
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Pegasus 4 - 150mm silicon oxide and silicon nitride etching
The user manual and contact information can be found in LabManager:
DRIE Pegasus 4 in LabManager - requires login
Process information
Standard recipes
Hardware changes
A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.
Wafer bonding
To find information on how to bond wafers or chips to a carrier wafer, click here.