Specific Process Knowledge/Lithography/EBeamLithography/BEAMER: Difference between revisions
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*''Symmetric Fracturing:'' This will attempt to perserve as high symmetry across the x- and y-axis as possible. | *''Symmetric Fracturing:'' This will attempt to perserve as high symmetry across the x- and y-axis as possible. | ||
*''Subfield Fracturing:'' Will force any fracture field to be smaller or equal to the subfield size. The subfield size is controlled on the ''Fields'' pane and on the JEOL 9500 system the maximum subfield size is 4 µm. | *''Subfield Fracturing:'' Will force any fracture field to be smaller or equal to the subfield size. The subfield size is controlled on the ''Fields'' pane and on the JEOL 9500 system the maximum subfield size is 4 µm. | ||
''Trapezoids:'' Controls the direction of fractured trapezoid shapes, if they can be in both x- and y-directions or only one of them. | |||
''Interactive Resorting of Fields:'' This will allow the user to manually determine the field writing order. | |||
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Illustration of the three different fracture modes on a 400 nm diameter circle. From left to right the fracture modes are ''Conventional'', ''LRFT'' and ''Curved''. | Illustration of the three different fracture modes on a 400 nm diameter circle. From left to right the fracture modes are ''Conventional'', ''LRFT'' and ''Curved''. | ||
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