Specific Process Knowledge/Lithography/EBeamLithography/BEAMER: Difference between revisions
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===Fracture=== | ===Fracture=== | ||
Before pattern writing the polygons of a design must be fractured into trapezoids filled with beam/shot positions. Careful setup of how a design is fractured and shots are placed can greatly enhance the end result both in terms of critical dimension accuracy, line edge roughness and pattern stitching between writing fields. | Before pattern writing the polygons of a design must be fractured into trapezoids filled with beam/shot positions. Careful setup of how a design is fractured and shots are placed can greatly enhance the end result both in terms of critical dimension accuracy, line edge roughness and pattern stitching between writing fields. | ||
The ''Fracture'' node has three main panes, ''General'', ''Advanced'' and ''Fields'' (if using ''Flat with Fields''). The options found on the ''General'' pane are: | |||
''Maintain grid:'' Check this to fracture at the database grid size, in most cases 1 nm. If unchecked the fracturing resolution can be changed in the ''Resolution'' field. The fracture resolutions should be set to the writing grid resolution, in most cases 1 nm. | |||
''Beam Step Size Correction:'' | |||