Specific Process Knowledge/Lithography/EBeamLithography/BEAMER: Difference between revisions
| Line 37: | Line 37: | ||
| Grid || Can be used to increase layout grid and reduce geometry vertice count | | Grid || Can be used to increase layout grid and reduce geometry vertice count | ||
|- | |- | ||
| Mapping || | | Mapping || Used to rename layers | ||
|- | |- | ||
| Filter || | | Filter || Used to select geometry based on rules, for instance by dimensions | ||
|- | |- | ||
| Fracture || | | Fracture || Gives the user much more control over pattern fracturing than the default export fracturing | ||
|- | |- | ||
| ChipPlace || Graphical interface to set up arrays of patterns and assign dose to each element, excellent for dose testing | | ChipPlace || Graphical interface to set up arrays of patterns and assign dose to each element, excellent for dose testing | ||
|- | |- | ||
| Visual-Job || | | Visual-Job || Graphical user interface that can be used to entirely setup a job and have Beamer write the SDF and JDF files | ||
|- | |- | ||
| PEC || Used to apply Proximity Effect Correction to a pattern | | PEC || Used to apply Proximity Effect Correction to a pattern by dose modulation | ||
|- | |- | ||
| Shape-PEC || | | Shape-PEC || Applies PEC by both dose modulation and shape modulation, i.e. by moving pattern edges | ||
|- | |- | ||
| 3D-PEC || | | 3D-PEC || Can be used for PEC of thick resist layers for gray scale lithography or PEC on multi-resist layer structures | ||
|- | |- | ||
| Corner-PEC || | | Corner-PEC || PEC with emphasis on creating sharp corners | ||
|- | |- | ||
| FDA || | | FDA || Feature Dose Assignment, allows assignment of doses to pattern elements, regions or entire layers | ||
|- | |- | ||
| Rule-OPC || | | Rule-OPC || | ||