Specific Process Knowledge/Lithography/EBeamLithography/EBLsubstratePrep: Difference between revisions
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{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="95%" | |||
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!colspan="4" border="none" style="background:silver; color:black;" align="center"|Current EBL resist stock in E4 | |||
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|-style="background:silver; color:black" | |||
|'''Resist''' | |||
|'''Bottle size''' | |||
|'''Expiration''' | |||
|'''Approximate amount remaining [L]''' | |||
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|- | |||
|-style="background:WhiteSmoke; color:black" | |||
|'''[[Specific_Process_Knowledge/Lithography/CSAR|CSAR AR-P 6200]]''' | |||
|Positive | |||
|[http://www.allresist.com AllResist] | |||
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-P6200_CSAR62english_Allresist_product-information.pdf AR-P 6200 info] | |||
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] or [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] | |||
|a = 7252.2, b = -0.454 | |||
|Anisole | |||
| | |||
*AR-600-546 | |||
*AR-600-548 | |||
*N50 | |||
*MIBK:IPA | |||
|IPA | |||
| | |||
*AR-600-71 | |||
*Remover 1165 | |||
|[[media:Process_Flow_CSAR.docx|CSAR]] <br> [[media:Process Flow CSAR with Al.docx|CSAR with Al]] <br> [[media:Process_Flow_LOR5A_CSAR_Developer_TMAH_Manual.docx|LOR5A with CSAR]] <br> | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
|'''[[Specific_Process_Knowledge/Lithography/ARN8200|Medusa AR-N 8200]]''' | |||
|Negative | |||
|[http://www.allresist.com AllResist] | |||
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf AR-N 8200 info] | |||
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] | |||
|a = ?, b = ? | |||
|AR 600-07 | |||
|AR 300-47:DIW (1:1) | |||
|DIW | |||
|BOE | |||
| | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
|'''[[Specific_Process_Knowledge/Lithography/ARN7500|AR-N 7500]]''' | |||
|Negative | |||
|[http://www.allresist.com AllResist] | |||
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-N7500_english_Allresist_product-information.pdf AR-N 7500 info] | |||
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] | |||
|a = 17126, b = -0.435 | |||
|PGMEA | |||
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*AR 300-47:DIW (4:1) | |||
*MIF726:DIW (8:5) | |||
|DIW | |||
| | |||
*AR 300-73 | |||
*O2 plasma | |||
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|} | |||
=== Discharge layer application === | === Discharge layer application === | ||