Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions

Revision as of 10:03, 13 July 2023 view source Jehem (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip 1,890 edits →Exposure dose for mask aligners ← Older edit		Revision as of 10:03, 13 July 2023 view source Jehem (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip 1,890 edits →Exposure dose when using AZ 351B developer (NaOH) Newer edit →
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	All doses are for standard silicon wafers, unless otherwise stated. Development is done using AZ 351B developer (NaOH).		All doses are for standard silicon wafers, unless otherwise stated. Development is done using AZ 351B developer (NaOH).


	===KS Aligner (351B)===		===KS Aligner (351B)===