Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Bonding: Difference between revisions
New page: ; Question 1 : A user tried to etch through a wafer using a carrier and crystalbond as medium (see image below). Even though he ran the standard SPTS process (with 14 % etch load) at 0 deg... |
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; Question 1 | ; Question 1 | ||
: A user tried to etch through a wafer using a carrier and crystalbond as medium (see image below). Even though he ran the standard SPTS process (with 14 % etch load) at 0 degrees, the wafer slid off the carrier. The crystalbond used melts at 65 degrees, is there any type with higher melting point? | : A user tried to etch through a wafer using a carrier and crystalbond as medium (see image below). Even though he ran the standard SPTS process (with 14 % etch load) at 0 degrees, the wafer slid off the carrier. The crystalbond used melts at 65 degrees, is there any type with higher melting point? | ||