Specific Process Knowledge/Thermal Process: Difference between revisions
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''This page is written by DTU Nanolab internal'' | ''This page is written by DTU Nanolab internal'' | ||
== Choose a process type == | == Choose a process type == | ||
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*[[/Dope with Phosphorus|Doping with Phosphorus]] | *[[/Dope with Phosphorus|Doping with Phosphorus]] | ||
*[[/Pyrolysis|Pyrolysis]] | *[[/Pyrolysis|Pyrolysis]] | ||
== Choose an equipment to use == | == Choose an equipment to use == | ||
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*[[/RTP Annealsys|RTP Annealsys]] - ''For rapid thermal annealing and smoothing of Si based materials'' | *[[/RTP Annealsys|RTP Annealsys]] - ''For rapid thermal annealing and smoothing of Si based materials'' | ||
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | *[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | ||
== Rules for storage and RCA cleaning of wafers to the A and C stack furnaces == | == Rules for storage and RCA cleaning of wafers to the A and C stack furnaces == | ||
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== Manual for the furnace computer to the A, B, C and E stack furnaces == | == Manual for the furnace computer to the A, B, C and E stack furnaces == | ||
The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here | The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here in [https://labmanager.dtu.dk/function.php?module=MiscDocument&view=docs&page_id=387| LabManager] (login required): | ||
== Decommissioned equipment == | == Decommissioned equipment == | ||