Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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==TPT Wire Bonder== | ==TPT Wire Bonder== | ||
[[Image:bond head - wedge insert.jpg|300px|thumb|Bond head with insert | [[Image:bond head - wedge insert.jpg|300px|thumb|TPT wire bonder<br/>Bond head with insert showing wedge capillary]] | ||
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.'' | [[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.'' | ||
Revision as of 10:50, 23 June 2023
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TPT Wire Bonder
Bond head with insert showing wedge capillary
Will be temporary taken out of service during the PolyFabLab construction.
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
Ball Wire Bonder K&S 4524
Will be moved to building 451 during the PolyFabLab construction.
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
| Equipment | TPT Wire Bonder | Ball Wire Bonder | |
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| Substrates | Allowed materials |
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