Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | <i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | ||
[[Category: Equipment|Thin film Wordentec]] | [[index.php?title=Category:Equipment|Thin film Wordentec]] | ||
[[Category: Thin Film Deposition|Wordentec]] | [[index.php?title=Category:Thin Film Deposition|Wordentec]] | ||
==Wordentec QCL 800== | ==Wordentec QCL 800 ['''THIS TOOL HAS BEEN DECOMMISSIONED]'''== | ||
[[Image:Wordentec.jpg|300x300px|thumb|Wordentec: positioned in cleanroom D-2 in the Wordentec room]] | [[Image:Wordentec.jpg|300x300px|thumb|Wordentec: positioned in cleanroom D-2 in the Wordentec room]] | ||
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E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | ||
[[Media:WaferAfterWordentec.JPG|Delaminating Au film on thin E-beam resist]] | [[index.php?title=Media:WaferAfterWordentec.JPG|Delaminating Au film on thin E-beam resist]] | ||
===Thermal evaporation materials=== | ===Thermal evaporation materials=== | ||