Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/OldConfig: Difference between revisions
| Line 5: | Line 5: | ||
=== Past configurations === | === Past configurations === | ||
==== Configuration valid from June 13 2022 to May 17 2023==== | |||
{{Template:Peg2configheader1 | |||
|TableHeader= 6: Currently valid from June 13 2022 onwards | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Available gasses and gas chemistry | |||
|ItemConfiguration= '''Available gasses:''' | |||
* SF<sub>6</sub>: 50 sccm | |||
* O<sub>2</sub>: 50 sccm | |||
* Ar: 283 | |||
* N<sub>2</sub>: 500 sccm | |||
* He: 11 sccm | |||
'''Not available:''' | |||
* C<sub>4</sub>F<sub>8</sub> (H<sub>2</sub> currently fitted but closed) : 0 sccm | |||
* CO<sub>2</sub>: (It is not in the software) | |||
|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Plasma source heaters | |||
|ItemConfiguration=The following heaters in the plasma source are off: | |||
* Plenum Heater | |||
* Inner Heater | |||
* Magnetic Confinement Heater | |||
* Chamber Heater | |||
|ItemComment= The temperature on the heaters in the plasma source are set to 20 degrees with a high tolerance. This essentially corresponds to powered off compared to default Pegasus temperatures which are in the 120-140 degrees range. The absence of fluorocarbons in the plasma makes it unnecessary to maintain a high temperature on the chamber walls in order to reduce polymer condensation (see below). | |||
Always make sure that the temperature settings in the recipes are ''not'' enabled. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/TemperatureSettings |'''here''']] to have more information. | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Carbon free plasmas | |||
|ItemConfiguration= The process chamber does not have any carbon containing etch gasses. Therefore, polymer build-up on the chamber walls is not an issue. The 'carbon free' policy does not, however, apply to the choice of masking materials and CSAR, AZ and DUV resists are allowed. | |||
|ItemComment= | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Chamber conditioning and cleaning | |||
|ItemConfiguration= Running long oxygen cleans is not necessary and must be avoided. Neither are shorter cleans between wafers. | |||
|ItemComment= The absence of carbon containing etch gasses ensures that the process chamber is kept clean. | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Recipes | |||
|ItemConfiguration= In the past, only recipes in the 'std' folder were allowed to run. Now, you can develop your own recipes '''as long as they don't violate any of the limitations/restrictions and rules in this table.''' | |||
|ItemComment= Be extremely careful with recipes in other folders than your own or the 'std' folder as they may no longer be safe to run because of hardware changes. | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Etch of chromium and silicon nitrides | |||
|ItemConfiguration= Recipes for etching chromium and silicon nitrides have been developed. | |||
|ItemComment= Etching the two materials is only allowed for processes in combination with other Pegasus 2 specific recipes such as the CORE recipe. '''Always consult with Nanolab staff.''' | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Electrostatic clamping, chip bonding with Galden oil and helium backside cooling are no longer being used. | |||
|ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures | |||
* Electrostatic clamping of carriers/substrates | |||
* Helium backside cooling | |||
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier | |||
will no longer be required. | |||
|ItemComment= So far we have not seen any changes in the results but if you do, please contact Nanolab staff. | |||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Background knowledge required for safe operation | |||
|ItemConfiguration= The users and supervisors of Pegasus-2 must carefully read the 4 papers listed in the comments in order to have a correct understanding of the etch process and experimental procedure and how it relates to the Bosch etch performance. | |||
|ItemComment= See the papers in the [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2#Publications_on_the_CORE_process |section below]]. | |||
}} | |||
|} | |||
==== Configuration valid from May 25 2022 to June 13 2022 ==== | ==== Configuration valid from May 25 2022 to June 13 2022 ==== | ||