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Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions

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Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,179 edits
Line 217: Line 217:
The JDF is terminated with a END command.
The JDF is terminated with a END command.


=Global alignment exposure - direct exposure mode=
=Alignment exposure - direct exposure mode=
Exposure with alignment
As described in the pattern preparation section there is two different strategies for pattern alignment. One can expose a wafer scale layout based on two global alignment marks or one can do chip exposures where each chip is individually aligned to an individual chip mark, as illustrated below.


==Schedule file==
{| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
|-
| [[image:EBL_align.png|1000px]]
|-
| colspan="1" style="text-align:center;|
Illustration of wafer scale pattern alignment and chip array alignment for two designs, L1 and L2.
|}


==Jobdeck file==
==Global alignment - schedule file==
 
==Global alignment - jobdeck file==


=Beam pitch, beam current and exposure dose relationship=
=Beam pitch, beam current and exposure dose relationship=
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