Specific Process Knowledge/Characterization: Difference between revisions
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*[[/Hardness measurement|Hardness tester]] | *[[/Hardness measurement|Hardness tester]] | ||
*[[/Particle Scanner Takano|Particle Scanner Takano]] | *[[/Particle Scanner Takano|Particle Scanner Takano]] | ||
*[[/X-Ray Diffractometer|X-Ray Diffractometer ]] | *[[/X-Ray Diffractometer|X-Ray Diffractometer ]] | ||
*[[/XRD|XRD SmartLab]] | *[[/XRD|XRD SmartLab]] | ||
==Decommissioned equipment=== | |||
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]] | |||
Revision as of 13:06, 17 April 2023
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Overview of characteristics and where to measure it
| Optical Micro- scopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflec- tometer) | Ellip- someter | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester | Surfscan | IR-camera | III-V ECV-profiler | |
| Breakdown voltage | |||||||||||||||||||
| Carrier density/doping profile | x | ||||||||||||||||||
| Charge carrier life time | x | ||||||||||||||||||
| Contact angle hydrophobic/hydrophillic | x | ||||||||||||||||||
| Crystallinity | x | ||||||||||||||||||
| Deposition uniformity | x | x | x | ||||||||||||||||
| Dimensions(in plane) | x | x | (x) | (x) | x | ||||||||||||||
| Dimensions(height)/Topography | (x) | (x) | x | x | x | ||||||||||||||
| Electrical conductivity | x | ||||||||||||||||||
| Element analysis | x | x | x 4) | x 4) | |||||||||||||||
| Film stress | x | x | |||||||||||||||||
| Imaging | x | x | x | x | |||||||||||||||
| Material Hardness | x | ||||||||||||||||||
| Band gap | x | x | x | ||||||||||||||||
| Particles | x | x | x | x | |||||||||||||||
| Phase changes | |||||||||||||||||||
| Reflectivity | x | x | x 6) | ||||||||||||||||
| Refractive index | x | x | |||||||||||||||||
| Resistivity | x | ||||||||||||||||||
| Step coverage | x 1) | x 1) | |||||||||||||||||
| Surface roughness | x | x | x | x | |||||||||||||||
| Thermal conductivity | |||||||||||||||||||
| Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 5) | x 3) | x | |||||||||
| Voids in wafer bonding | x | x | x | ||||||||||||||||
| Wafer thickness | x 1) | x 1) | x | ||||||||||||||||
| Work function | x |
- Using the cross section method
- Using the create step method
- With known resistivity
- Composition information for crystalline materials
- Only single layer
- Good for characterization of VCSEL structures and DBR mirrors
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Hardness measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
- Optical Profiler (Sensofar)
- Dektak XTA stylus profiler
- P17 stylus profiler from KLA-Tencor
- Dektak 3ST stylus profiler
- Stylus Profiler:Dektak150
Optical microscopes
Optical characterization
SEMs at DTU Nanolab - building 307/314
SEM's in building 346
TEMs at DTU Nanolab - building 307/314
Electrical measurements
- 4-Point Probe
- Probe station
- III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
Various
- Drop Shape Analyzer
- Thickness Measurer
- Hardness tester
- Particle Scanner Takano
- X-Ray Diffractometer
- XRD SmartLab