Specific Process Knowledge/Characterization/Particle Scanner Takano: Difference between revisions

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+The Takano WM-7SR wafer surface analyzer is being used to analyze unpatterned surfaces on wafers for particles.
+The instrument detects, counts and sizes defects on wafers with semiconductor substrate materials. The instrument uses a 405 nm laser beam which is scanning over the wafer surface to detect defect contamination, i.e. particles. When the laser beam hits a particle, it will scatter and be detected.
+The scan results are displayed in color-coded wafer maps, histograms and summaries.
+===Specifications===
+- Particles having a size between 79 nm um and 5 um can be detected. The minimum particle size can only be detected on smooth surfaces such as bare silicon wafers or wafers with thermal SiO2.
+- The detected particles sizes depends on the used gain setting.<br />
+- Wafer cassettes are available for 4”, 6” and 8” wafers. For the 4” wafer cassette, an adapter has to be mounted on the indexer.<br />
+- The wafer thickness should be a standard wafer thickness +/- 200 nm. Wafers that thicker than 1 mm need to get an approval from a responsible person.<br />
+- Area Count software function which helps to detect the larger particles (>11um) is not currently equipped but it is available for purchase.<br />