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Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.  
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.  
    
    
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]


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==Equipment performance and process related parameters==


*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]]
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==Equipment performance and process related parameters==


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