Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
No edit summary |
No edit summary |
||
| Line 11: | Line 11: | ||
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding. | The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding. | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | ||
<!-- remember to remove the type of documents that are not present --> | <!-- remember to remove the type of documents that are not present --> | ||
| Line 24: | Line 24: | ||
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters. | The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters. | ||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager (requires login):''' | ||
<!-- remember to remove the type of documents that are not present --> | <!-- remember to remove the type of documents that are not present --> | ||
Revision as of 14:41, 27 March 2023
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
TPT Wire Bonder
Packlab, Building 347, 1st floor
Will be temporary taken out of service during the PolyFabLab construction.
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
Ball Wire Bonder K&S 4524
Packlab, Building 347, 1st floor
Will be moved to building 451 during the PolyFabLab construction.
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager (requires login):
| Equipment | TPT Wire Bonder | Ball Wire Bonder | |
|---|---|---|---|
| Purpose |
|
| |
| Performance |
|
| |
| Substrates | Allowed materials |
| |