Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions

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 |style="background:LightGrey; color:black"|
 *Max. 2000 SCCM
-|style="background:WhiteSmoke; color:black;" align="left"|'''Not allowed''' for users.
+|style="background:WhiteSmoke; color:black;" align="left"|
 |-
 |style="background:Silver; color:black"|NH<sub>3
 |style="background:LightGrey; color:black"|
 *Max. 2000 SCCM
-|style="background:WhiteSmoke; color:black;" align="left"|'''Not allowed''' for users.
+|style="background:WhiteSmoke; color:black;" align="left"|'''Not tested'''.
 |-
 |style="background:Silver; color:black"|5% H<sub>2</sub>/Ar
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 *Silicon Nitride
 *Aluminum Oxide
-|style="background:WhiteSmoke; color:black;" align="left"| '''Silicon nitride''' and '''aluminum oxide''' are only used as '''coating/masking materials''' and have been proven capable of sustaining this type of high temperature processing.
+|style="background:WhiteSmoke; color:black;" align="left"| During previous testing, '''silicon nitride''' and '''aluminum oxide''' were only used as '''coating/masking materials''' and have been proven capable of sustaining this type of high temperature processing.
 |-
 |}