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Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions

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The shot time can be calculated as ''t = D·p<sup>2</sup>/I'', where ''D'' is the dose in µC/cm<sup>2</sup>, ''p'' is beam pitch and ''I'' is current. As a practical example let us consider an exposure at 2 nA beam current and a desired dose of 250 µC/cm<sup>2</sup>. At 4 nm beam pitch the shot time will come out to 20 ns, while at 2 nm beam pitch it will come out at 5 ns and thus violate the hardware limitation of 10 ns. In order to expose the pattern with 2 nm shot pitch one would have to choose a lower beam current at the expense of increased writing time.
The shot time can be calculated as ''t = D·p<sup>2</sup>/I'', where ''D'' is the dose in µC/cm<sup>2</sup>, ''p'' is beam pitch and ''I'' is current. As a practical example let us consider an exposure at 2 nA beam current and a desired dose of 250 µC/cm<sup>2</sup>. At 4 nm beam pitch the shot time will come out to 20 ns, while at 2 nm beam pitch it will come out at 5 ns and thus violate the hardware limitation of 10 ns. In order to expose the pattern with 2 nm shot pitch one would have to choose a lower beam current at the expense of increased writing time.
Start estimation writing time  -----
Shot counting start -----
  thopeQU23008a.v30                                              at 11-MAR-2023 14:53:40
Shot counting end -----
  Seq.  writing time    shottime[nsec]  resist[uC/cm2]  stdcur[nA]  scanstep
  1        0:52:27            16.000          200.000        2.000        16
  2        0:13:46            13.500          200.000      12.000        36
  3        0:11:15            12.000          100.000      12.000        48
  4        0:12:10            13.500          200.000      12.000        36
  5        0:11:14            12.000          100.000      12.000        48
Total :    1:40:51
Estimation result file : thopeQU23008a.csv
End estimation writing making time    -----