Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions
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The JDF is terminated with a END command. | The JDF is terminated with a END command. | ||
==Beam pitch and dose relationship== | ==Beam pitch, beam current and exposure dose relationship== | ||
A sample is exposed at a user selected beam current to provide a user defined exposure dose. The system will calculate the shot time (dwell time) of the beam to provide the requested dose. It is clear that high doses will require long dwell times whereas low doses will require short dwell times. There is however another important parameter to the dwell time calculation and that is the beam/shot pitch, i.e. how far beam shots are placed from each other. The beam scanner on the JEOL 9500 system is 100 MHz, thus the temporal resolution is 10 ns and it is not possible to have a beam shot (or dwell time) less than 10 ns. This, in combination with selected beam current and exposure dose will set a lower limit on the beam pitch. | A sample is exposed at a user selected beam current to provide a user defined exposure dose. The system will calculate the shot time (dwell time) of the beam to provide the requested dose. It is clear that high doses will require long dwell times whereas low doses will require short dwell times. There is however another important parameter to the dwell time calculation and that is the beam/shot pitch, i.e. how far beam shots are placed from each other. The beam scanner on the JEOL 9500 system is 100 MHz, thus the temporal resolution is 10 ns and it is not possible to have a beam shot (or dwell time) less than 10 ns. This, in combination with selected beam current and exposure dose will set a lower limit on the beam pitch. | ||