Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | ||
''The Cammax EDB80 Die bonder is currently (only temporary) taken out of service during the PolyFabLab construction.'' | |||
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier. | The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier. | ||
Revision as of 15:50, 3 July 2025
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Die bonder (eutectic metal soldering)
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.
The Cammax EDB80 Die bonder is currently (only temporary) taken out of service during the PolyFabLab construction.
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
The user manuals, user APVs, technical information and contact information can be found in LabManager:
Process information
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| Substrates | Allowed materials |
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