Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing. | |||
[[File:IMG_20230228_112922.jpg|thumb|800px|Dicers positioned on 1. floor bldg 346 room 157]] | |||
Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer. | Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer. | ||