Specific Process Knowledge/Bonding: Difference between revisions
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'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | '''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | ||
For bonding samples to a carrier wafer in order to enable '''dry etching''', please go [[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding|here]]. | For bonding samples to a carrier wafer in order to enable '''dry etching''', please go [[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding|here]]. | ||