Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions
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*Chips on carrier | *Chips on carrier | ||
*100 mm or 150 mm wafers | *100 mm or 150 mm wafers | ||
|style="background:WhiteSmoke; color:black;" align=" | |style="background:WhiteSmoke; color:black;" align="left"| '''Small samples''' must be '''placed''' on '''dedicated carrier wafers'''. These '''do not need''' to be bonded to the carrier wafers. | ||
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| style="background:Silver; color:black"|Allowed materials | | style="background:Silver; color:black"|Allowed materials | ||