Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions
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''January 2023: The RTP Annealsys is being tested, but it is not released for general use yet. Please contact thinfilm@nanolab.dtu.dk for more information.'' | ''January 2023: The RTP Annealsys is being tested, but it is not released for general use yet. Please contact thinfilm@nanolab.dtu.dk for more information.'' | ||
'''RTP Annealsys (RTP AS-Premium, serial number AS0415C4 - 7484, from ANNEALSYS)''' is a research tool available at DTU Nanolab that can reach very high temperatures in a matter of a few minutes or even seconds. Therefore, it is able to perform several types of rapid thermal processing and it can be used as a multi-functional and versatile microfabrication tool, within specific process windows for each process type, using Si/nanofabricated Si structures. Amongst them, there is rapid thermal annealing '''(RTA)''', hydrogenation '''(RTH)''', oxidation '''(RTO)''', nitridation '''(RTN)''', etc. Currently, it is used for '''rapid thermal annealing and smoothing''' of silicon-based samples. | |||
[[File:LL&station Annealsys.png|250px|thumb|center|The RTP Annealsys work station and loadlock are located in the DTU Nanolab cleanroom B-1. Photo: Maria Farinha@DTU Nanolab, February 2023]] | [[File:LL&station Annealsys.png|250px|thumb|center|The RTP Annealsys work station and loadlock are located in the DTU Nanolab cleanroom B-1. Photo: Maria Farinha@DTU Nanolab, February 2023]] | ||
==The Set-Up== | ==The Set-Up== | ||
The RTP Annealsys system is divided into two main parts: the process chamber and the loadlock. | The RTP Annealsys system is divided into two main parts: the process chamber and the loadlock. | ||
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Moreover, the chamber and the loadlock are separated by the gate valve. While processing, the valve remains closed; it is only opened to exchange the substrates when both chamber and loadlock are under turbo vacuum. The substrate transfer is possible due to the mechanical, retractable arm. | Moreover, the chamber and the loadlock are separated by the gate valve. While processing, the valve remains closed; it is only opened to exchange the substrates when both chamber and loadlock are under turbo vacuum. The substrate transfer is possible due to the mechanical, retractable arm. | ||
[[File:Set up.png|600px|thumb|center|Schematic representation of the rapid thermal processor set-up profile view. The substrate (in green) rests on top of three quartz pins, supported by a quartz holder (in black). The drawing is not to scale. Image: Inês Diogo@DTU Nanolab, December 2022]] | |||
==Temperature Measurement and Control== | ==Temperature Measurement and Control== | ||