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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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=Oven 250C=
{{:Specific Process Knowledge/Lithography/Pretreatment/Oven_250C}}
[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment in Cx-1]]
The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven.
 
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=117 Oven 250C] - '''requires login'''
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