Specific Process Knowledge/Etch/Etching of Silicon Nitride: Difference between revisions
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*Chromium (ONLY RIE2!) | *Chromium (ONLY RIE2!) | ||
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|Etch rate | |||
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|Typically 40-50 nm/min can be increased or decreased by using other recipe parameters. | |||
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|Process volume | |Process volume | ||
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