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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
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*'''(2001) DCH PEB 110C 60s'''
*'''(2001) DCH PEB 110C 60s'''
*'''(2002) DCH PEB 110C 120s'''
*'''(2002) DCH PEB 110C 120s'''
Process parameters: Bake at 110°C. 20s cool at 20°C.
 
 
'''Process parameters:'''
*Bake at 110°C
*20s cool at 20°C.


==Combined PEB and development==
==Combined PEB and development==
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