Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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===Dry etches:=== | ===Dry etches:=== | ||
*Dry etch using RIE1 or RIE2 | *[[/Si etch using RIE1 or RIE2|Dry etch using RIE1 or RIE2]] | ||
*Dry etch using ASE | *[[/Si etch using ASE|Dry etch using ASE]] | ||
==Comparison of KOH etch, wet PolySilicon etch, RIE etch and ASE etch for etching of Silicon== | ==Comparison of KOH etch, wet PolySilicon etch, RIE etch and ASE etch for etching of Silicon== | ||