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Specific Process Knowledge/Lithography/Baking: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,913 edits
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Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C]'''
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C] - '''requires login'''


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