Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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|<40nm/min to >600nm/min depending on recipe parameters | |<40nm/min to >600nm/min depending on recipe parameters and mask design | ||
| | |<130nm/min to >5.6 µm/min depending on recipe, mask design and aspect ratio. | ||
|- | |- | ||
|Size of substrate | |Size of substrate | ||