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Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

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!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator Temescal]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|Ar ion etch
|Ar ion etch (only in E-beam evaporator Temescal)
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|  
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|0.5Å/s to 15Å/s
|1Å/s to 10Å/s
|10Å/s to 15Å/s
|1Å/s to 15Å/s
|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s
|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s
|Depending on [[/Al sputtering in Sputter System (Lesker) |process parameters]] at least up to 0.7 Å/s
|Depending on [[/Al sputtering in Sputter System (Lesker) |process parameters]] at least up to 0.7 Å/s
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*6x6" wafers
*6x6" wafers
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|
*Up to one 8" wafer (limited uniformity on large substrates)
*Up to 3 x 4" wafers or one 6" or 8" wafer (limited uniformity on large substrates)
*Many small chips


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
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Approx. 5 min plus 6 min transfer time
Approx. 5 min plus 6 min transfer time
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Approx. 1,5 hour
Approx. 1.5 hour
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Approx. 15 min
Approx. 15 min
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* Silicon wafers
Almost any that will not outgas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
* Quartz wafers
* Pyrex wafers
 


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* Silicon wafers
Almost any that does not outgas. Ask if in doubt or see the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
* Quartz wafers
* Pyrex wafers


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials
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|
* Silicon oxide
Almost any as long as it does not outgas and no fragile structures risk dropping off into the machine. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
 


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* Metals  
* Metals  
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* Silicon oxide
Almost any that does not outgas and will not drop fragile structures into the machine.
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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