Specific Process Knowledge/Pattern Design: Difference between revisions
| Line 26: | Line 26: | ||
* For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. | * For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. | ||
* For '''UV-lithography''' | * For '''UV-lithography''' you create a layout file with your design. The file format should preferably be CIF or GDS. The electronic mask layout can be used directly in one of our [[Specific Process Knowledge/Lithography/UVExposure|Mask Less Aligners (MLAs)]] or you can have a physical mask produced based on the layout file. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask_Ordering_and_Fabrication|Mask Fabrication for UV-lithography]]. | ||
* For '''DUV-lithography''' and DUV-lithography it is necessary to have physical masks (reticles) produced based on the layout file. The file format has to be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Process_information|Design of Reticles]]. | * For '''DUV-lithography''' and DUV-lithography it is necessary to have physical masks (reticles) produced based on the layout file. The file format has to be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Process_information|Design of Reticles]]. | ||