Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions
Appearance
No edit summary |
No edit summary |
||
| Line 2: | Line 2: | ||
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | '''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | ||
== The Cleaver: LatticeAxe == | |||
The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving. | The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving. | ||