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Specific Process Knowledge/Back-end processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
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**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
* Chip/die mounting
* Chip/die mounting
**[[/Die Bonder|Die Bonder (eutectic metal)]]
**[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
*Wire bonding
*Wire bonding
**[[/Wire Bonder|TPT Wire Bonder]]
**[[/Wire Bonder|TPT Wire Bonder]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
*Wafer dicing/machining
*Wafer dicing/machining
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|style="background: LightGray"|
|style="background: LightGray"|
*[[/Die Bonder|Die Bonder (eutectic metal)]]
*[[/Die Bonder|Die Bonder (eutectic metal)]]
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
|style="background: LightGray"|
|style="background: LightGray"|
*[[/Wire Bonder|TPT Wire Bonder]]
*[[/Wire Bonder|TPT Wire Bonder]]
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