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Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions

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===Etch rates: Empirical formula (Seidl et al)===
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The following empirical formula can be used for concentrations in the range of 10-60 wt%:
The following empirical formula can be used for concentrations in the range of 10-60 wt%:
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where k<sub>0</sub> = 2480 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.595 eV for Si(100)
where k<sub>0</sub> = 2480 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.595 eV for Si(100)


and  k<sub>0</sub> = 4500 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.60 eV for Si(110)
and  k<sub>0</sub> = 4500 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.60 eV for Si(110) -->