Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions
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| ''' 1 µm pillars''' || [[File:Pillar 0C+S-RIE Al2O3 02bbbb.jpg|300px]] [[File:Pillar 0C+S-RIE Al2O3 08bbbb.jpg|300px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~30nm of it). | | ''' 1 µm pillars''' || [[File:Pillar 0C+S-RIE Al2O3 02bbbb.jpg|300px]] [[File:Pillar 0C+S-RIE Al2O3 08bbbb.jpg|300px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~30nm of it). | ||
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| ''' 1 µm holes''' || | | ''' 1 µm holes''' || [[File:bitmapddddd.jpg|300px]] [[File:holes.tif.jpg|300px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~16nm of it). | ||
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| '''200nm nanoholes''' || 2 || 220 mTorr | | '''200nm nanoholes''' || 2 || 220 mTorr | ||