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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

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NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Mfarin (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
781 edits
Line 25: Line 25:
! !! After Al<sub>2</sub>O<sub>3</sub> etch !! After BARC etch  
! !! After Al<sub>2</sub>O<sub>3</sub> etch !! After BARC etch  
|-
|-
| '''O-step''' || 10 || 220 mTorr  
| ''' 1 µm pillars''' || 10 || 220 mTorr  
|-
|-
| '''R-step''' || 10 || 100%  
| ''' 1 µm holes''' || 10 || 100%  
|-
|-
| '''E<sub>1</sub>-step''' || 2 || 220 mTorr
| '''200nm nanoholes''' || 2 || 220 mTorr  
|-
| '''E<sub>2</sub>-step''' || 1-5 || 220 mTorr  
|}
|}


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