Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions
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=Al<sub>2</sub>O<sub>3</sub> mask= | =Al<sub>2</sub>O<sub>3</sub> mask= | ||
[[File:esq met Al2O3 compact.jpg| | [[File:esq met Al2O3 compact.jpg|300px|left|thumb|'''''Scheme of the sample fabrication using Al<sub>2</sub>O<sub>3</sub> mask. The alumina oxide samples had layers with different thicknesses, of 50 or 100 nm of Al<sub>2</sub>O<sub>3</sub>, followed by 65 nm of BARC and 750 nm of DUV resist. No at scale. From @Nanolab internal, August 2022''''']] | ||
In these samples, the hard mask, Al<sub>2</sub>O<sub>3</sub>, was coated in the 150 mm Si wafers using the ALD 1 tool. These sets of samples also had the lithography process done in the DUV stepper to deposit 65 nm of BARC and 750 nm of DUV resist. Three different patterns were created after the development: | In these samples, the hard mask, Al<sub>2</sub>O<sub>3</sub>, was coated in the 150 mm Si wafers using the ALD 1 tool. These sets of samples also had the lithography process done in the DUV stepper to deposit 65 nm of BARC and 750 nm of DUV resist. Three different patterns were created after the development: | ||