Specific Process Knowledge/Lithography: Difference between revisions
No edit summary |
|||
| Line 3: | Line 3: | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]''' | ||
[[Category: Equipment|Lithography]] | |||
[[Category: Lithography]] | [[Category: Lithography]] | ||
| Line 179: | Line 180: | ||
'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>''' | '''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>''' | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]] | *[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]] | ||
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] | *[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Labspin 02/03]] | *[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Labspin 02/03]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]] | *[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]] | ||
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]] | |||
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]] | |||
'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>''' | '''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>''' | ||
| Line 193: | Line 194: | ||
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]] | *[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]] | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]] | *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]] | ||
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]] | |||
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]] | *[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]] | ||
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]] | *[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]] | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]] | *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]] | ||
'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>''' | '''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>''' | ||
| Line 212: | Line 213: | ||
| style="width: 20%"; valign="top"| | | style="width: 20%"; valign="top"| | ||
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>''' | '''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>''' | ||
*[[Specific Process Knowledge/Lithography/Development#Developer: | *[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]] | ||
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]] | |||
*[[Specific Process Knowledge/Lithography/Development#SU8-Developer|Developer: SU8]] | |||
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper|Developer: TMAH Stepper]] | |||
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]] | *[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]] | ||
'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>''' | '''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>''' | ||
*[[Specific Process Knowledge/Lithography/ | *[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]] | ||
*[[Specific Process Knowledge/Lithography/ | *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]] | ||
*[[Specific Process Knowledge/Lithography/ | *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3:Descum]] | ||
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]] | *[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]] | ||
| Line 228: | Line 229: | ||
'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>''' | '''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>''' | ||
*[[Specific Process Knowledge/Lithography/Strip# | *[[Specific Process Knowledge/Lithography/Strip#Plasma_asher|Plasma Asher 1]] | ||
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]] | *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]] | ||
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]] | *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]] | ||