Specific Process Knowledge/Lithography/SU-8: Difference between revisions
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The goal of the post exposure bake is to increase the polymerization reaction (the cross-linking). The post exposure step can be done on the same hotplates as the soft bake step, with the temperature range between 20°C and 120°C, and with temperature ramping of 5-8 deg/min. | The goal of the post exposure bake is to increase the polymerization reaction (the cross-linking). The post exposure step can be done on the same hotplates as the soft bake step, with the temperature range between 20°C and 120°C, and with temperature ramping of 5-8 deg/min. | ||
'''NB:''' It is important to do the post exposure bake immediately after exposure to limit photoinitiator diffusion into non-exposed areas. | '''NB:''' It is important to do the post exposure bake immediately after exposure to limit photoinitiator diffusion into non-exposed areas. | ||