Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions
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'''Up''' = Facing the chamber; '''Up, covered''' = facing the chamber, covered with an identical (in size) Si chip during the process; '''Flipped''' = Facing the carrier wafer; '''HF dip''' = 30s-HF chemical bath, immediately prior to processing. | |||
==== RTH ==== | ==== RTH ==== | ||