Specific Process Knowledge/Lithography/Descum: Difference between revisions
Appearance
| Line 8: | Line 8: | ||
[[File:Descum Results aug 2019.png|640px|thumb|right|Descum results plasma asher 1. September 2019]] | [[File:Descum Results aug 2019.png|640px|thumb|right|Descum results plasma asher 1. September 2019]] | ||
'''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach= | '''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=55 LabManager].''' | ||
Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer. | Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer. | ||