Specific Process Knowledge/Lithography/Descum: Difference between revisions
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=Plasma asher 1= | =Plasma asher 1= | ||
[[ | [[File:Descum Results aug 2019.png|640px|thumb|right|Descum results plasma asher 1. September 2019]] | ||
'''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager].''' | '''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager].''' | ||
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|'''Ashing time (min)'''|| 1|| 2 || 5 || 7 || 10 || 10 | |'''Ashing time (min)'''|| 1|| 2 || 5 || 7 || 10 || 10 | ||
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|'''Etched Thickness (nm)'''|| | |'''Etched Thickness (nm)'''|| - || 8.1 || 32.9 || 271.1 || 495.6 || 446.2 | ||
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==Descum tests on UV resists== | ==Descum tests on UV resists== | ||
''Conny Hjort & Jesper Hanberg, September | ''Conny Hjort & Jesper Hanberg, September 2021'' | ||
[[Image:PA1_descum.jpg|640px|thumb|Descum results plasma asher 1. August 2021]] | |||
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Descum of different resists, AZ5214E, AZ701 MiR and AZ2020 nLOF, on a single 100mm wafer was tested. Wafer was placed vertically in the middle of glass carrier. | Descum of different resists, AZ5214E, AZ701 MiR and AZ2020 nLOF, on a single 100mm wafer was tested. Wafer was placed vertically in the middle of glass carrier. | ||