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Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions

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|Up
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!SSP (single side polished)
!RTA 2
|4"
|Ar
|N or P
|40
|525 µm
|1305
|1-20 Ωcm
|80
|0.18
|180
|No
|Up, covered
|-
|-
!SSP (single side polished)
!RTA 3
|6"
|Ar
|N
|40
|625 µm
|1244
|10-20 Ωcm
|80
|0.18
|60
|No
|Up, covered
|-
|-
!SSP (single side polished)
!RTA 4
|8"
|Ar
|N
|40
|725 µm
|1307
|1-10 Ωcm
|80
|0.18
|8
|No
|Up
|-
|-
!DSP (double side polished)
!RTA 5
|4"
|Ar
|N or P
|40
|350 µm
|1308
|1-20 Ωcm
|80
|0.18
|60
|No
|Up
|-
|-
!DSP (double side polished)
!RTA 6
|4"
|Ar
|N
|40
|500 µm
|1309
|1-20 Ωcm
|80
|-
|0.18
!DSP (double side polished)
|180
|6"
|No
|N
|Up
|500 µm
|1-20 Ωcm
|-
!Fused silica wafers
|4"
| 
|500 µm or 1 mm
| 
|-
!Boron glass wafers
|4"
| 
|500 µm
| 
|-
!pre-processed<sup>{{fn|1}}</sup>
|4" and 6"
|&nbsp;
|&nbsp;
|&nbsp;
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