Jump to content

Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions

Jehem (talk | contribs)
Jehem (talk | contribs)
Line 6: Line 6:
However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.
However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.


'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager] - '''requires login'''


===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===