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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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Jehem (talk | contribs)
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Another commonly used method to render the surface of silicon wafers hydrophobic is the dilute HF dip.
Another commonly used method to render the surface of silicon wafers hydrophobic is the dilute HF dip.


BHF is mostly used to do pretreatment step for new Si wafers. The native dioxide layer will be removed during 30 sec etching and in this way we will promote the resist adhesion on the Si substrates. We recommend to spin resist asap after the procedure.
BHF is mostly used to do pretreatment for new Si wafers.<br>
The native oxide layer will be removed during 30 sec etching and this will promote the resist adhesion on the Si substrates. We recommend to spin coat resist as soon as possible after the procedure.


'''The user manual, user APV, and contact information can be found in LabManager:'''
'''The user manual, user APV, and contact information can be found in LabManager:'''
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