Jump to content

Specific Process Knowledge/Lithography/EBeamLithography/EBLLandingpage: Difference between revisions

Thope (talk | contribs)
Thope (talk | contribs)
Line 252: Line 252:
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|Anisole
|Anisole
|ZED-N50/Hexyl Acetate,n-amyl acetate, oxylene. [[media:JJAP-51-06FC05.pdf‎|JJAP-51-06FC05.pdf‎]], [[media:JVB001037.pdf‎|JVB001037.pdf‎]]
|ZED-N50/Hexyl Acetate,n-amyl acetate, oxylene. [[media:JJAP-51-06FC05.pdf‎|JJAP-51-06FC05‎]], [[media:JVB001037.pdf‎|JVB001037]]
|IPA
|IPA
|acetone/1165
|acetone/1165
Line 264: Line 264:
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
|Approved, not tested yet. Used for trilayer (PE-free) resist-stack or double-layer lift-off resist stack. Please contact [mailto:Lithography@nanolab.dtu.dk Lithography] for information.
|Approved, not tested yet. Used for trilayer (PE-free) resist-stack or double-layer lift-off resist stack. Please contact [mailto:Lithography@nanolab.dtu.dk Lithography] for information.
|[[media:AR_P617.pdf‎|AR_P617.pdf‎]]
|[[media:AR_P617.pdf‎|AR_P617]]
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|PGME
|PGME
Line 278: Line 278:
|[http://http://www.microresist.de/home_en.htm MicroResist]
|[http://http://www.microresist.de/home_en.htm MicroResist]
|Standard negative resist
|Standard negative resist
|[[media:mrEBL6000 Processing Guidelines.pdf‎|mrEBL6000 processing Guidelines.pdf‎]]
|[[media:mrEBL6000 Processing Guidelines.pdf‎|mrEBL6000 processing Guidelines‎]]
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|Anisole
|Anisole
Line 307: Line 307:
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
|Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@dtu.dk Peixiong Shi] for information.
|Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@dtu.dk Peixiong Shi] for information.
|[[media:AR-N7500-7520.pdf‎|AR-N7500-7520.pdf‎]]
|[[media:AR-N7500-7520.pdf‎|AR-N7500-7520]]
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|PGMEA
|PGMEA
Line 320: Line 320:
|Positive
|Positive
| [http://www.allresist.com AllResist]
| [http://www.allresist.com AllResist]
|We have various types of PMMA in the cleanroom. Please contact [mailto:Lithography@nanolab.dtu.dk Lithography] for information.
|
|
|
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
Line 342: Line 342:
|IPA
|IPA
|acetone/1165
|acetone/1165
|Trilayer stack: [[media:Process_Flow_Trilayer_Ebeam_Resist.docx‎|Process_Flow_Trilayer_Ebeam_Resist.docx‎]]
|Trilayer stack: [[media:Process_Flow_Trilayer_Ebeam_Resist.docx‎|Process Flow‎]]


|}
|}