Specific Process Knowledge/Lithography/EBeamLithography/EBLLandingpage: Difference between revisions

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	== Substrate preparation ==		== Substrate preparation ==
	An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR (AR-P 6200.09) is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV\|Spin Coater: Gamma E-beam and UV]] for ~~easy~~ spin coating of 2", 4" and 6" substrates. Other substrate sizes or resist have to be used in ~~the Labspin 2~~/~~3 coating systems~~. The standard resist bottles are stored in the chemical cupboard in E-4.		An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR (AR-P 6200.09) is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV\|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. Other substrate sizes or resist have to be used in [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters\|Spin Coater: LabSpin 02]]. The standard resist bottles are stored in the chemical cupboard in E-4.